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December 2013

Enhancing Thermal Transport of Carbon Nanotubes

Scientific Achievement

In a User project with Intel, Foundry scientists have shown that the use of short organic molecules that form covalent bonds between metal surfaces and vertically aligned carbon nanotubes (CNTs) leads to a six-fold reduction in thermal interface resistance.

Significance and Impact

Thermal interface resistance is the bottleneck that limits the performance of highly conductive CNTs for heat control in numerous technologies including microprocessors. Covalent bonds across the interface can break this bottleneck.

Research Details

S. Kaur, N. Raravikar, B. A. Helms, R. Prasher & D. F. Ogletree. Nat. Commun. 2013 [in press].