Specialized Instrumentation Available to Users
Clean room and Mini-environment
The cleanroom suite comprises more than 400 square meters, divided into clean-class 100 and 10,000 areas with temperature control of approximately 1 degree °C and humidity control within 5% RH, and a mini-environment of class 1 with temperature control of (Federal Standard 209E). The class 100 section is an area of approximately 150 square meters, equipped with modular and programmable HEPA fan-filter units. Each fan-filter unit is individually controllable and structurally self-contained, allowing for easy replacement, removal, or relocation. The flexibility of the clean-air system coupled with the modular design of the internal wall structure ensures that the clean suite is reconfigurable with a minimum of disruption to operations.
Vistec VB300UHR EWF Electron-Beam Lithography System
A fundamental part of equipment in any nanofabrication laboratory is the electron beam Lithographic System (EBL). The VB300 is a state of the art product from Vistec Lithography Limited (formerly Leica Microsystems Lithography Limited) and it is derived from the highly successful VB6HR and UHR systems, it could be applied to many key applications. This system can deliver a spot size of less than 3nm and can generate nano-lithography structures of <10nm with state-of-the-art electron optics.
The VB300 system:
- provides rapid exposure with 50Mhz pattern generator and 20bits resolution
- 1.2 mm maximum writing field
- Stage placement accuracy 15 - 30 nm
- Overlay 2 - 10 nm
- Beam current 100 pA - 100 nA
- can load and write wafer substrates ranging from piece parts to 300mm
- can load and write up to 7 inch mask plates
- features z-axis stage control for specialized substrate types
- routinely produces line width structures of less than 10nm
- includes a high-current-density thermal field emission gun for operation at 50keV to 100keV
- can load up to ten substrate simultaneously and handle them automatically
- can be operated remotely through a networked environment
With its industry-leading stability, high resolution, accuracy and overall flexibility, the VB300 is especially suited to the development and production of many types of advanced devices in the areas of silicon CMOS, single electron transistors, quantum functional devices and photonic elements on a wide range of wafer substrates and masks, including EUV, X-ray and nano-imprint. The following table shows the list of substrate holders.
| Number | Size(inches) | Substrate Type | Serial Number | Glass Thickness (mm) |
| 1 | 2X3 | Wafer | 336 | |
| 2 | 4 | Wafer | 344 | |
| 3 | 5 | Wafer | 406 | |
| 4 | 6 | Wafer | 407 | |
| 5 | 6 | Wafer | 337 | |
| 6 | 8 | Wafer | 348 | |
| 7 | 5 | Mask | 341 | 0.09 |
| 8 | 6 | Mask | 403 | 0.09 |
| 9 | 6 | Mask | 402 | 0.09 |
| 10 | 6 | Mask | 405 | 0.25 |
| 11 | 6 | Mask | 404 | 0.25 |
Zeiss XB1540 EsB and Ultra60 Zeiss
The 1500XB CrossBeam® workstations combine the good imaging capabilities of the GEMINI® field emission column (FESEM) with the sophisticated Orsay Physic focused ion beam (FIB). This series was made mainly like the ultimate 3-D research tool for material analysis and semiconductor metrology applications. It offers a comprehensive and versatile multi-channel gas injection system for ion beam deposition of metals or insulators and for enhanced etching. The unique CrossBeam® 1540 EsB system comprises dual In-column detectors for ultra high resolution topographical and compositional imaging. The new In-column EsB (Energy selective Backscatter) detector is less sensitive for edge contrast and charging effects which enables precise feature imaging and reliable metrology. It delivers superb materials contrast and crystallographic imaging.
Key Features:
- Ultra high resolution FESEM with GEMINI® column: 1.1 nm at 20 kV and 2.5 nm at 1 kV
- High resolution Orsay Physic Column (liquid gallium source):7-5 nm at 30 kV
- Ultra high efficiency EsB detector for compositional information
- ultra high resolution live SE/BSE imaging during FIB milling and polishing
- Automated TEM preparation software package
- multi channel gas injection system for deposition(Platinum, Tungsten, Insulator) and etching (water and Fluorine)
- Magnification: SEM 20x - 900kx: FIB600x - 500kx
- Probe Current: SEM 4 pA - 20 nA: FIB 1 pA - 50 nA
- Acceleration Voltage: SEM 0.1 - 30 kV; FIB 3 - 30 kV
- Emitters: Thermal field emission type and Ga liquid metal ion source (LMIS)
- In-column Detector EsB with filtering grid (BSE grid voltage 0 - 1500V)
- In-lens detector: High efficiency annular type (SE)
- Secondary electrons detector ET type (SE)
- Back Scattered Detector (BSD) solid state type
- STEM GEMINI® Multimode Bright Field and Dark Field
- Specimen Chamber 330 mm ø, 270 mm height
- 2 IR CCD-camera for sample viewing
- Specimen Stage 6-axes fully eucentric, all motorized (X = 102 mm Y = 102 mm Z = 43 mm Z. = 10 mm Tilt = -10 - 60° R = 360° continuous
- Kleindiek MM3A-EM 3 axis micromanipulator.
The ULTRA 60 is an FESEM ideal for large samples. It has the new Energy and angle selective Backscattered electron (EsB) detector integrated in the GEMINI® column. It has a fully eucentric stage and an integrated 8 inch airlock. The resolution is: 1.0 nm at 15 kV; 1.7 nm at 1 kV; 4.0 nm at 0.1 kV. It has the same set of detectors as the Crossbeam.
Molecular Imprint Imprio 55
Step and Flash Imprint Lithography (S-FIL™) technology is based on the ancient craft of embossing, with an adaptation to modern semiconductor needs. The technique uses a fused silica template with a micro and nano-pattern etched into it. The fused silica surface, covered with a release layer, is gently pressed into a thin layer of low viscosity, silicon-containing monomer. When illuminated by a UV lamp, the surface is polymerized into a hard material. Upon separation of the fused silica template, the circuit pattern is left on the surface. A residual layer of polymer between features is eliminated by an etch process, and a perfect replica of the pattern is ready to be used in nanofabrication processing for etch or deposition. Only the template fabrication process, typically accomplished with an ebeam writer and plasma etcher ICP - RIE, limits the resolution of the features. Features as small as 20 nm have been made to date that exceed the present requirements in the International Technology Roadmap Semiconductors (ITRS). The parameters in the classic photolithography resolution formula (k1, NA, and lambda) are not relevant to S-FIL, because this technology does not use reduction lenses. The resolution of S-FIL is a direct function of the resolution f the template fabricating process. Therefore, S-FIL tools are multi-generational and should have longer life than optical lithography tools, which have to be replaced when the exposure wavelength is decreased. S-FIL templates are typically fabricated using conventional optical phase-shift mask technology. Electron beam writers that provide high resolution, but lack the thoughput required for mass production, are used. S-FIL, therefore, takes advantage of the resolution offered by e-beam technology, without compromising throughput and tool life. The Molecular Imprints Imprio® 55 is based on the unique Step and Flash Imprint Lithography technology. The Imprio 55 delivers high resolution, moderate alignment, and 3-dimensional replication of small size, sub-50 nanometer resolution, lithographic patterns.
Resolution: Sub-50 nm.
Alignment: < 1 micron, 1 sigma (X, Y and Rotation).
Flexibility: Handles up to 200 mm wafers, including fragile substrates.
Field size: up to 25 x 25 mm active print area.
XENOS Pattern Writer XeDraw 2 – SEM and FIB Pattern Generator System
Writing speed: up to 10 Mpixels/sec - Resolution: 16 Bit, writing field size of 50000 x 50000 pixels - Implemented shapes: dot, single pixel line, rectangular primitives, trapezoids, triangles, parallelograms, arrays, 3rd order polynomials, circles, rings or ring segments - Writing clock: 10 kHz up to 10 Mhz
Veeco Caliber SPM – AFM (CA260701)
Scans up to 90 x 90μm with a 10μm Z range; Permits analysis of odd size samples Closed-loop scanning; Provides distortion-free zoom, pan at any scan angle; Eliminates piezo nonlinearity, hysteresis, and creep; Precision Force Spectroscopy with customizable controls; Sensored Z; Accurate height measurements; Contact Mode; TappingMode™ PhaseImaging™ Lateral Force Microscopy (LFM) Force Modulation Microscopy (FMM) Force Distance Curves
Veeco Dektac 150 profiler (250G8)
Stylus Force 1 to 15mg with LIS 3 sensor; 0.03 to 15mg – Stylus Options Stylus radius options from 50nm to 25µm; Sample Stage Manual X/Y/Θ, 100 x 100mm X-Y translation, 360° rotation, manual leveling; 3D Mapping with Vision analysis software; Scan Length Range 55mm (2.16in.); Data Points Per Scan 60,000 maximum; Max. Sample Thickness Up to 90mm (3.5in.), depending on configuration; Max. Wafer Size 150mm (6in.); Step Height Repeatability 6Å, 1 sigma on 0.1µm step; Vertical Range 524µm (0.02in.) standard; 1mm (0.039in.)
ABM optical contact printer
The ABM is a optical mask aligner with a broadband Hg arc lamp source. It can handle wafer up to 8” with a vacuum holder. It has a vacuum system for the contact lithography process. IR illumination is provided for the double face alignment. It can reach a resolution of 2 microns.
Semicore e-beam and thermal evaporator
This system can produce films on substrates using resistive heating or focused e-beam (10 keV) to cause vaporization or sublimation materials held in a crucible. One film or a series of films can be deposited on substrates. A crystal oscillator is used to monitor film thickness in situ. In the machine: Titanium slug; Chrome slug; Copper slug; Gold pellets (in a tungsten crucible). On the shelf Nickel pellets; Copper pellets; Chromium pellets; Titanium pellets; Aluminum pellets; Germanium pellets; Silver pellets. Approx 10 thermal evaporation boats 1 Tungsten crucible; 3 Vitreous Carbon crucibles; 3 Graphite crucibles; 3 Alumina crucibles, 4 Tungsten crucibles.
Wafab Wet Benches
The 3 Wafab's VLF front access wet process stations are dedicated to:
- to be used with organic flammable solvents (stainless steel “solvents” bench),
- to etch non-hazardous materials using hydrofluoric acid, potassium hydroxide and
- 30% hydrogen peroxide and sulfuric acid (Polypropylene “Acid and Base” bench)
- and for a large variety of wet processes (Polypropylene “Utility”bench).
They are compatible with class 100 clean rooms. They are provided with two sinks for hot lift-off processes, one sink for hot KOH etching process, one sink for hot Piranha and one for HF processes; all controlled by PLC. The open process area allows for laminar air to flow across the work surface capturing particles and fumes and directing them through the exhaust slots and out of the clean room. They are provided with a photohelic exhaust monitor, plenum liquid level sensor, n2 purged headcase, clear PVC sliding face shields, Teflon n2 and DI guns.
Spinning and coating station
Spin coaters are used to distribute photoresist in a thin uniform layer by spinning the substrate. The CEE 100CB spinners can run 6,000 RPM maximum spin speed with 5 RPM accuracy and handle from 0.5" to 8" substrates depending on chuck size. The CEE 100CB spinners are also equipped with hotplate designed for photoresist curing. These hotplates (300°C maximum temperature) feature optional vacuum contact for improved thermal contact between the substrate and hotplate. Two ovens (300°C maximum temperature) and one optical microscope complete the station.
Software
L-Edit Layout Editor gives designers complete control over all their layout operations. An easy-to-use, intuitive interface lets users begin designing immediately. It uses external GDSII cell libraries for a smooth design flow. It allows the user to perform complex Boolean and derived layer operations with arbitrary polygonal curves and shapes.
Use of CXRO Nanofabrication Laboratory
Molecular Foundry staff has access to Oxford Instruments ICP etching systems through a co-operation with the Nanofabrication group at the Center for X-ray Optics. This nanofabrication group focuses on diffractive x-ray optics for microscopy and interferometry, nanomagnetism, and EUV optics and metrology.
Microfabrication Laboratory, University of California Berkeley
The U.C. Berkeley Microfabrication Laboratory, Microlab, is the only facility on campus that provides research space and knowledge in state-of-the-art semiconductor and microfabrication technology. Microfabrication has wide ranging applications in various fields of engineering and sciences. The Microlab occupies roughly 10,000 sq. ft. in Cory Hall. The laboratory is operated as an ERL recharge operation, providing access to state-of-the-art fabrication capabilities to over 300 academic and industrial lab members.
Among the laboratory's major features are a computer area for device and circuit layout; a lithography center, which includes three step-and-repeat reduction cameras, two contact aligners, and a mask-making facility with an optical pattern generator; thin-film systems; 4"/6” silicon VLSI wafer processing areas equipped with LPCVD and atmospheric furnaces, process-specific plasma etchers, wet processing stations, and various types of
metrology equipment for in-line testing and specialized analytical diagnostics; a planarization laboratory with chemical-mechanical polish and interlayer dielectric deposition; and a satellite thin-film lab housing a 5-chamber high-vacuum cluster tool for dc-magnetron sputtering of metal-based thin-films. The facility supports a 0.5 µm CMOS baseline process.
